Courses:

Design and Fabrication of Microelectromechanical Devices >> Content Detail



Calendar / Schedule



Calendar



Lecture Outline


The number of lectures on each topic are given in parentheses. For the detailed schedule of topics, see the calendar below.



I. Introduction (0.5)


An overview of microelectromechanical devices and technologies, and an introduction to design and modeling.



II. Fabrication Technology (4)


Brief review of standard microelectronic fabrication technologies; detailed discussion of bulk micromachining, surface micromachining, bonding technologies, related fabrication methods, and creating process flows. Assignments will emphasize creating process flows, the relation between process and mask specifications and the resulting device geometry, and also the effect of etch selectivity on process viability.



III. Material Properties (0.5)


Definitions of mechanical, thermal, electrical, magnetic, optical, and chemical properties of materials.



IV. Lumped Modeling (3)


Introduction to lumped modeling of systems and transducers; an overview of system dynamics.



V. Split Sessions: Introductory Mechanics or Introductory Electronics (2)


Classes will be held in parallel on both introductory mechanics (2.001 - 2.002 level) and introductory electronics (6.002 level). Students with equivalent undergraduate mechanics preparation should attend the electronics sessions, and students with equivalent undergraduate electronics preparation should attend the mechanics sessions. Students who do not have equivalent undergraduate preparation in either area should attend the electronics sessions. A mechanics make up session will be scheduled for those students.



VI. Mechanics: Special Topics (1)


MEMS examples, energy methods.



VII. Dissipation (2)


The thermal energy domain; modeling dissipative processes.



VIII. Fluids and Transport (3)


A necessarily brief introduction to the fluid mechanics and transport processes relevant at the microscale.



IX. System Issues (2)


Feedback and noise.



X. Case Studies and Special Topics (6)


While students are working on final projects, there will be a series of eight lectures covering packaging, design tradeoffs, as well as case studies taken from various MEMS disciplines (e.g., optical MEMS, accelerometers, BioMEMS, Power MEMS).



Calendar


JV: Session taught by Joel Voldman

CL: Session taught by Carol Livermore


LEC #TOPICSLECTURERSKEY DATES
1Introduction to MEMS; microfabrication for MEMS: part IJV/CL
2Microfabrication for MEMS: part IICLProblem set 1 out
3Microfabrication for MEMS: part IIICL
4Microfabrication for MEMS: part IV; in-class fab problemCL

Problem set 1 due

Problem set 2 out

5Fabrication for the life sciences; material propertiesCL
6Elasticity or electronics ICL/JV

Problem set 2 due

Problem set 3 out

7Structures or electronics IICL/JV
8Lumped-element modelingJV
9Energy-conserving transducersJV

Problem set 3 due

Problem set 4 out

10Dynamics, especially nonlinearJV
11Structures special topicsCLDesign problem out
12Thermal energy domain; dissipationJVProblem set 4 due
13Modeling dissipative processesJV

Design problem due

Problem set 5 out 2 days before L13

14Fluids 1JV

Problem set 5 due

Problem set 6 out

15Fluids 2JV
16TransportJV

Problem set 6 due

Problem set 7 out

17FeedbackJV
18NoiseCL
19PackagingCLProblem set 7 due
20In-class design problemCL
21Design tradeoffsCL
22Power MEMS case studyCL
23Optical MEMS case studyCL
24Capacitive accelerometer case studyJV
25BioMEMS case studyJV
Final presentationsFinal report due 6 days after L25

 








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